Item | Performance characteristics |
---|---|
Socket/<br>Header | Header |
Number of Pins | 30 |
Mated Height (mm) | 0.8mm |
Family Name (Head of Product No.) | AXF6 |
Type | BOARD-TO-FPC |
Applications | DSC, Mobile devices |
Terminal Pitch (mm) | 0.35 |
Soldering Terminals | with |
Positioning Bosses | without |
Body Length (mm) | 6.90 |
Body Height (mm) | 0.65 |
Short Width | 2.00 |
Recommended PC Board Pattern Width (mm) | 2.40 |
Molded Portion Material | LCP resin (UL94V-0) |
Contact and Post Material | Copper alloy |
Surface Treatment Material | Base: Ni plating Surface: Au plating |
Rated Current | 1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts) |
Insulation Resistance (Min. MΩ)(Initial) | 1000 |
Dielectric Strength | 150V AC for 1min. |
Contact Resistance (M&Omega: Max.) | 30 |
Insertion and Removal Life (Times) | 30 |
Packing Quantity | EMBOSSED TAPE AND PLASTIC REEL |
Packing Quantity; Inner Carton (Pcs.) | 5,000 pieces (1-reel) |
Packing Quantity; Outer Carton (Pcs.) | 10,000 pieces |
Piece Type | 2 Pieces type (Header) |
The service is owned, operated, controlled and managed by Panasonic's distributors.
For pricing, delivery and technical questions related to this service, please direct to them.
Panasonic assumes no responsibility for any dealings you may have with distributors.
B01 & B02 Series Board-to-FPC Connectors