Part Number List

Results 34
Models table for series A4US(0.4mm pitch)
Part No.DatasheetSocket/HeaderNumber of PinsMated Height (mm)Family Name (Head of Product No.)TypeApplicationsTerminal Pitch (mm)Soldering TerminalsPositioning BossesBody Length (mm)Body Height (mm)Packing Quantity; Outer Carton (Pcs.)Recommended PC Board Pattern Width (mm)Molded Portion Material Contact and Post MaterialSurface Treatment Material Rated CurrentInsulation Resistance (Min. MΩ)(Initial)Dielectric StrengthContact Resistance (M&Omega: Max.)Insertion and Removal Life (Times)Packing QuantityPacking Quantity; Inner Carton (Pcs.) Short Width
Header
34
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
8.60
0.65
20,000 pieces
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
1.80
Header
36
0.8mm
AXE2
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
9.00
0.65
20,000 pieces
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
1.80
Socket
16
0.6mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
5.70
0.59
20,000 pieces
2.60
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
2.20
Header
50
0.8mm
AXE2
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
11.80
0.65
20,000 pieces
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
1.80
Socket
24
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
7.30
0.77
20,000 pieces
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
2.00
Socket
34
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
9.30
0.77
20,000 pieces
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
2.00
Header
50
0.6mm
AXE2
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
11.80
0.46
20,000 pieces
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
1.28
Socket
36
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
9.70
0.77
20,000 pieces
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
2.00
Socket
80
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
18.50
0.77
20,000 pieces
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
2.00
Socket
50
0.6mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
12.50
0.59
20,000 pieces
2.60
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
2.20