Part Number List

Results 10
Models table for series Y3BL(0.3mm pitch)
Part No.DatasheetTerminal Pitch (mm)Number of PinsBody Height (mm)Family Name (Head of Product No.)Lock StructureTypeApplicationsContact Pitch (mm)Soldering TerminalsFPC Holding ContactsContact DirectionBody Length (mm)Recommended PC Board Pattern Width (mm)Molded Portion Material Contact and Post MaterialSurface Treatment Material Rated CurrentInsulation Resistance (Min. MΩ)(Initial)Dielectric StrengthContact Resistance (M&Omega: Max.)Insertion and Removal Life (Times)Packing QuantityPacking Quantity; Inner Carton (Pcs.) Packing Quantity; Outer Carton (Pcs.)
0.6
23
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
8.40
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
27
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
9.60
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
11
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
4.80
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
31
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
10.80
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
15
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
6.00
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
25
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
9.00
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
45
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
15.00
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
39
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
13.20
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
51
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
16.80
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
7
0.60
AYF3
Back lock
FPC
Smartphones, Tablet PCs, Mobile devices
0.3
without
without
Top contact
3.60
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
160
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces

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