EYG-T Series "Graphite-PAD" Thermal Interface Material

EYG-T Series "Graphite-PAD" Thermal Interface Material

High Thermal Conductivity In The Z-Direction With Superior Flexibility

Panasonic, a worldwide leader in Thermal Management Products, is pleased to introduce NEW EYG-T Series “Graphite-PAD”.  This new addition to Panasonic’s line of Thermal Management solutions is a thermal interface material that compatibly obtains excellent thermal conductivity in Z-axis thickness direction along with providing superior flexibility. The new Graphite-PAD product provides properties that are greater than that of most existing thermal interface materials.

Graphite-PADs are composed of silicone resin and Pyrolytic Graphite Sheets (PGS) as filler.  This combination of materials offers high Thermal Management reliability by enabling designs with high heat dissipation.   The PGS inside the resin is oriented in a vertical direction as shown in Figure 1. This oriented structure provides excellent thermal conductivity in thickness direction. The component is very flexible (deformable) since it is mainly composed of silicone resin. Being deformable with a low load facilitates installation.

Features

  • Excellent Thermal Conductivity In Z-Axis Thickness Direction
  • Thermal Conductivity Of The Material: 13 W/m・K
  • Excellent Flexibility
  • Thickness Range:  0.5 to 3.0 mm
  • Hardness: TYPE E 25
  • Excellent Compressibility:  50% (t=2 mm, Pressure 300 kPa)
  • Tackiness:  Material Holds Onto Surface Or Component
  • High Reliability:  Corresponds To -40oC to 150oC and Maintains Long-Term Reliability
  • RoHS Compliant

Benefits

  • Can Be Bent And Used On Curved Surfaces
  • Compressibility Up To Almost 60%
  • Tackiness On Both Sides Of The Pad Due To The Silicone Resin Holds The Material Onto A Surface Or Component
  • Improved Thermal Conductivity In Thickness Direction Is Obtained By Having PGS Graphite Sheet® Oriented In Vertical Direction Filled Into Silicon Resin
  • Provides Efficient Heat Conduction Thanks To Its High Adhesion Performance Generated From Flexibility. Flexibility Also Provides Degree Of Freedom In Design Because The Component Can Be Set Onto Heat Sources With A Low Load

Model List

Found 12 matches. Display 1 - 12 matches.
Part No.sort descendingData SheetSize (mm)Thickness (μm)Thermal conductivity (W/(m・K))Electrical characteristicsParts Inventory
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design engineersPanasonicEYGT3535A05A
35×35 0.5mm13 Non-insulated
design engineersPanasonicEYGT3535A10A
35×35 1mm13 Non-insulated
design engineersPanasonicEYGT3535A15A
35×35 1.5mm13 Non-insulated
design engineersPanasonicEYGT3535A20A
35×35 2mm13 Non-insulated
design engineersPanasonicEYGT3535A25A
35×35 2.5mm13 Non-insulated
design engineersPanasonicEYGT3535A30A
35×35 3mm13 Non-insulated
design engineersPanasonicEYGT7070A05A
70×700.5mm13 Non-insulated
design engineersPanasonicEYGT7070A10A
70×701mm13 Non-insulated
design engineersPanasonicEYGT7070A15A
70×701.5mm13 Non-insulated
design engineersPanasonicEYGT7070A20A
70×702mm13 Non-insulated
design engineersPanasonicEYGT7070A25A
70×702.5mm13 Non-insulated
design engineersPanasonicEYGT7070A30A
70×703mm13 Non-insulated

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