Panasonic Showcases New High-Performance Electronic Assembly Materials at SMTA International

Panasonic cordially invites you to visit booth #909 at the 20th annual SMTA International Conference and Exhibition taking place September 22-26, 2019 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies and related business operations.  

Panasonic's Electronic Materials Division will be showcasing leading-edge electronic assembly materials including adhesives, epoxy flux, underfills, high-speed circuit board laminates and IC substrates in booth #909 of the exposition hall on Tuesday, September 24 and Wednesday, September 25.

As part of the technical conference, Panasonic will be presenting two research papers: “Improved IC Package Reliability via Epoxy Flux Reinforcement“ (Reliability Enhancement Through Bonding Session FSA4, Wednesday, September 25, 2019, 1:00 am - 12:30 pm) and “Advanced PCB Lamination Material Development for High-Sped Networking Applications” (Surface Finish Effects Session SUB2, Tuesday, September 24, 2019 2:00 pm – 3:30 pm.)

If you are interested in a detailed conversation with one of our Electronic Material Engineering Experts, please email andy.behr@us.panasonic.com to make an appointment at the Panasonic booth.

For complete show details, click through to SMTA International below.

SMTA International Website

Panasonic Showcases New High-Performance Electronic Assembly Materials at SMTA International

Panasonic cordially invites you to visit booth #909 at the 20th annual SMTA International Conference and Exhibition taking place September 22-26, 2019 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies and related business operations.  

Panasonic's Electronic Materials Division will be showcasing leading-edge electronic assembly materials including adhesives, epoxy flux, underfills, high-speed circuit board laminates and IC substrates in booth #909 of the exposition hall on Tuesday, September 24 and Wednesday, September 25.

As part of the technical conference, Panasonic will be presenting two research papers: “Improved IC Package Reliability via Epoxy Flux Reinforcement“ (Reliability Enhancement Through Bonding Session FSA4, Wednesday, September 25, 2019, 1:00 am - 12:30 pm) and “Advanced PCB Lamination Material Development for High-Sped Networking Applications” (Surface Finish Effects Session SUB2, Tuesday, September 24, 2019 2:00 pm – 3:30 pm.)

If you are interested in a detailed conversation with one of our Electronic Material Engineering Experts, please email andy.behr@us.panasonic.com to make an appointment at the Panasonic booth.

For complete show details, click through to SMTA International below.

SMTA International Website

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