Specifications
Item | Performance characteristics |
---|---|
Tg (DSC) (°C) | - |
Tg (TMA), (°C) | 190 (Ad) |
Tg (DMA) (°C) | 210 (Ad) |
Td (Thermal Decomposition) (°C) | - |
T288 (Without Cu) (min) | - |
T288 (With Cu) (min) | - |
CTE-X, <Tg (ppm/℃) | 80 (Ad) |
CTE-Y <Tg (ppm/℃) | 80 (Ad) |
CTE-Z <Tg (ppm/℃) | 210 (Ad) |
CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | 210 (Ad) |
Thermal Conductivity, (W/m・K) | - |
Volume Resistivity (MΩ・cm) | 1 x 10⁸ Condition:C-96/20/65 |
Surface Resistivity (mΩ) | 3 x 10⁸ Condition:C-96/20/66 |
Dk at 1 GHz | 3.0 |
Dk at 10 GHz | - |
Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | - |
Df at 1 GHz | 0.019 |
Df at 10 GHz | - |
Df at 12 GHz | - |
Water Absorption (%) | 1.2 Condition:E-24/50+D-24/23 |
Flexural Warp (MD) (GPa) | - |
Flexural Fill (TD) (GPa) | - |
Peel Strength (1 Oz. Cu) (kN/m) | 0.8 (ED:12μm) |
Flammability | 94VTM-0 Measured by R-FR10/R-F775 25μm/R-FR10 construction |
Sample Thickness (mm) | 0.032mm (Cu:12μm, PI:5μm, Ad:15μm) |
Stock check
R-FR10
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