Felios Series

Flexible Circuit Board Materials Suitable For A Wide Range of Applications

Featuring Felios Polyimide (R-F775 for double-side and R-F770 for single side), Felios Liquid Crystal Polymer (R-F570S), Felios BM low Dk bonding sheet (R-BM17) and Felios Flexible Resin-Coated Copper foil (R-FR10)

Felios Adhesiveless Flex Circuit Board Materials are available in a variety of film and copper foil thicknesses to support many applications. The Flexible Circuit Board laminates offer superior thermal resistance, dimensional stability and quality.  All are suitable for a wide range of end-use products such as mobile devices as well as medical, industrial and avionics applications.

Series List

Results 4
Series table for lineup Felios Series
Series/TypeDatasheetGlass Transition Temperature (Tg): Test Method TMA; Condition A (°C)CTE α1 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)Dielectric Constant (Dk) @ 10GHz: Test Method IPC-TM-650 2.5.5.9; Condition C-24/23/50Dielectric Constant (Dk) @ 12GHz: Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Dissipation Factor (Df) @ 10GHz: Test Method IPC-TM-650 2.5.5.5; Condition C-24/23/50Dissipation Factor (Df) @ 12GHz: Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50
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3.2 Test method:Cavity resonance
3.1(19GHz)
0.004 Test method:Cavity resonance
0.003(19GHz)
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3.3 Test method: Cavity resonance
2.9(19GHz)
0.002 Test method: Cavity resonance
0.002(19GHz)
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3.3 Test method: Cavity resonance
2.9(19GHz)
0.002 Test method: Cavity resonance
0.002(19GHz)
190 (Ad)
210 (Ad)
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