Featuring Felios Polyimide (R-F775 for double-side and R-F770 for single side), Felios Liquid Crystal Polymer (R-F705S), Felios BM low Dk bonding sheet (R-BM17) and Felios Flexible Resin-Coated Copper foil (R-FR10)
Felios Adhesiveless Flex Circuit Board Materials are available in a variety of film and copper foil thicknesses to support many applications. The Flexible Circuit Board laminates offer superior thermal resistance, dimensional stability and quality. All are suitable for a wide range of end-use products such as mobile devices as well as medical, industrial and avionics applications.
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