Felios FRCC

Flexible Resin-Coated Copper Foil Helps Achieve A Thin Multi-Layer Circuit Board

R-FR10

The thinness of the materials and good coplanarity simplifies the build-up process and lets manufacturers achieve a thinner board: suitable for mobile applications.

Series image for Felios FRCC

Felios FRCC

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Models table for series Felios FRCC
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
R-FR10
-
190 (Ad)
210 (Ad)
-
-
-
80 (Ad)
80 (Ad)
210 (Ad)
210 (Ad)
-
1 x 10⁸ Condition：C-96/20/65
3 x 10⁸ Condition：C-96/20/66
3.0
-
-
0.019
-
-
1.2 Condition：E-24/50+D-24/23
-
-
0.8 (ED:12μｍ)
94VTM-0 Measured by R-FR10/R-F775 25μm/R-FR10 construction
0.032ｍｍ (Cu:12μｍ, PI:5μｍ, Ad:15μｍ)

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