Felios Polyimide

Flexible Polyimide Circuit Board Materials Suitable for Wide Range of Applications

R-F775 (Double-Sided)
R-F770 (Single-Sided)

Part Number List

Results 2
Models table for series Felios Polyimide
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y, CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
-
-
>340 (TPI 240)
577
-
-
18-20
16-19
-
-
0.16
-
-
3.2
3.2 Test method:Cavity resonance
3.1(19GHz)
0.002
0.004 Test method:Cavity resonance
0.003(19GHz)
0.9 Test method:Internal method
-
-
1.3(ED:18μm)
-
0.025mm
-
-
>340 (TPI 240)
577
-
-
18-20
16-19
-
-
0.16
-
-
3.2
3.2 Test method:Cavity resonance
3.1(19GHz)
0.002
0.004 Test method:Cavity resonance
0.003(19GHz)
0.9 Test method:Internal method
-
-
1.3(ED:18μm)
-
0.025mm

What's New

Stay up to date