Felios FRCC

Flexible Resin-Coated Copper Foil Helps Achieve A Thin Multi-Layer Circuit Board

R-FR10

The thinness of the materials and good coplanarity simplifies the build-up process and lets manufacturers achieve a thinner board: suitable for mobile applications.

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Models table for series Felios FRCC
Part No.	Datasheet	Tg (DSC) (°C)	Tg (TMA), (°C)	Tg (DMA) (°C)	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-X, <Tg (ppm/℃)	CTE-Y <Tg (ppm/℃)	CTE-Z <Tg (ppm/℃)	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dk at 1 GHz	Dk at 10 GHz	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-FR10		-	190 (Ad)	210 (Ad)	-	-	-	80 (Ad)	80 (Ad)	210 (Ad)	210 (Ad)	-	1 x 10⁸ Condition：C-96/20/65	3 x 10⁸ Condition：C-96/20/66	3.0	-	-	0.019	-	-	1.2 Condition：E-24/50+D-24/23	-	-	0.8 (ED:12μｍ)	94VTM-0 Measured by R-FR10/R-F775 25μm/R-FR10 construction	0.032ｍｍ (Cu:12μｍ, PI:5μｍ, Ad:15μｍ)

Models table for series Felios FRCC
Part No.	Datasheet	Tg (DSC) (°C)	Tg (TMA), (°C)	Tg (DMA) (°C)	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-X, <Tg (ppm/℃)	CTE-Y <Tg (ppm/℃)	CTE-Z <Tg (ppm/℃)	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dk at 1 GHz	Dk at 10 GHz	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-FR10		-	190 (Ad)	210 (Ad)	-	-	-	80 (Ad)	80 (Ad)	210 (Ad)	210 (Ad)	-	1 x 10⁸ Condition：C-96/20/65	3 x 10⁸ Condition：C-96/20/66	3.0	-	-	0.019	-	-	1.2 Condition：E-24/50+D-24/23	-	-	0.8 (ED:12μｍ)	94VTM-0 Measured by R-FR10/R-F775 25μm/R-FR10 construction	0.032ｍｍ (Cu:12μｍ, PI:5μｍ, Ad:15μｍ)

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