| | Header | 40 | 0.6mm | AXF6 | BOARD-TO-FPC | Wearable devices, Smartphones | 0.35 | with | without | 8.56 | 0.46 | 1.50 | 1.80 | LCP resin (UL94V-0) | Copper alloy | Base: Ni plating Surface: Au plating | 5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts | 1000 | 150V AC for 1min. | Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal) | 30 | EMBOSSED TAPE AND PLASTIC REEL | 15,000 pieces (1-reel) | 30,000 pieces |
| | Header | 60 | 0.6mm | AXF6 | BOARD-TO-FPC | Wearable devices, Smartphones | 0.35 | with | without | 12.60 | 0.46 | 1.50 | 1.80 | LCP resin (UL94V-0) | Copper alloy | Base: Ni plating Surface: Au plating | 5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts | 1000 | 150V AC for 1min. | Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal) | 30 | EMBOSSED TAPE AND PLASTIC REEL | 15,000 pieces (1-reel) | 30,000 pieces |
| | Socket | 34 | 0.6mm | AXF5 | BOARD-TO-FPC | Wearable devices, Smartphones | 0.35 | with | without | 8.45 | 0.59 | 1.70 | 2.00 | LCP resin (UL94V-0) | Copper alloy | Base: Ni plating Surface: Au plating | 5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts | 1000 | 150V AC for 1min. | Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal) | 30 | EMBOSSED TAPE AND PLASTIC REEL | 15,000 pieces (1-reel) | 30,000 pieces |
| | Socket | 40 | 0.6mm | AXF5 | BOARD-TO-FPC | Wearable devices, Smartphones | 0.35 | with | without | 9.50 | 0.59 | 1.70 | 2.00 | LCP resin (UL94V-0) | Copper alloy | Base: Ni plating Surface: Au plating | 5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts | 1000 | 150V AC for 1min. | Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal) | 30 | EMBOSSED TAPE AND PLASTIC REEL | 15,000 pieces (1-reel) | 30,000 pieces |
| | Header | 34 | 0.6mm | AXF6 | BOARD-TO-FPC | Wearable devices, Smartphones | 0.35 | with | without | 7.51 | 0.46 | 1.50 | 1.80 | LCP resin (UL94V-0) | Copper alloy | Base: Ni plating Surface: Au plating | 5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts | 1000 | 150V AC for 1min. | Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal) | 30 | EMBOSSED TAPE AND PLASTIC REEL | 15,000 pieces (1-reel) | 30,000 pieces |
| | Header | 50 | 0.6mm | AXF6 | BOARD-TO-FPC | Wearable devices, Smartphones | 0.35 | with | without | 10.31 | 0.46 | 1.50 | 1.80 | LCP resin (UL94V-0) | Copper alloy | Base: Ni plating Surface: Au plating | 5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts | 1000 | 150V AC for 1min. | Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal) | 30 | EMBOSSED TAPE AND PLASTIC REEL | 15,000 pieces (1-reel) | 30,000 pieces |
| | Socket | 50 | 0.6mm | AXF5 | BOARD-TO-FPC | Wearable devices, Smartphones | 0.35 | with | without | 11.25 | 0.59 | 1.70 | 2.00 | LCP resin (UL94V-0) | Copper alloy | Base: Ni plating Surface: Au plating | 5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts | 1000 | 150V AC for 1min. | Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal) | 30 | EMBOSSED TAPE AND PLASTIC REEL | 15,000 pieces (1-reel) | 30,000 pieces |
| | Socket | 60 | 0.6mm | AXF5 | BOARD-TO-FPC | Wearable devices, Smartphones | 0.35 | with | without | 13.00 | 0.59 | 1.70 | 2.00 | LCP resin (UL94V-0) | Copper alloy | Base: Ni plating Surface: Au plating | 5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts | 1000 | 150V AC for 1min. | Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal) | 30 | EMBOSSED TAPE AND PLASTIC REEL | 15,000 pieces (1-reel) | 30,000 pieces |
