Part Number List

Results 8
Models table for series S35H(0.35mm pitch)
Part No.DatasheetSocket/HeaderNumber of PinsMated Height (mm)Family Name (Head of Product No.)TypeApplicationsTerminal Pitch (mm)Soldering TerminalsPositioning BossesBody Length (mm)Body Height (mm)Short Width Recommended PC Board Pattern Width (mm)Molded Portion Material Contact and Post MaterialSurface Treatment Material Rated CurrentInsulation Resistance (Min. MΩ)(Initial)Dielectric StrengthContact Resistance (M&Omega: Max.)Insertion and Removal Life (Times)Packing QuantityPacking Quantity; Inner Carton (Pcs.) Packing Quantity; Outer Carton (Pcs.)
Header
40
0.6mm
AXF6
BOARD-TO-FPC
Wearable devices, Smartphones
0.35
with
without
8.56
0.46
1.50
1.80
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts
1000
150V AC for 1min.
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
30
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Header
60
0.6mm
AXF6
BOARD-TO-FPC
Wearable devices, Smartphones
0.35
with
without
12.60
0.46
1.50
1.80
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts
1000
150V AC for 1min.
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
30
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Socket
40
0.6mm
AXF5
BOARD-TO-FPC
Wearable devices, Smartphones
0.35
with
without
9.50
0.59
1.70
2.00
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts
1000
150V AC for 1min.
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
30
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Socket
34
0.6mm
AXF5
BOARD-TO-FPC
Wearable devices, Smartphones
0.35
with
without
8.45
0.59
1.70
2.00
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts
1000
150V AC for 1min.
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
30
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Header
34
0.6mm
AXF6
BOARD-TO-FPC
Wearable devices, Smartphones
0.35
with
without
7.51
0.46
1.50
1.80
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts
1000
150V AC for 1min.
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
30
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Header
50
0.6mm
AXF6
BOARD-TO-FPC
Wearable devices, Smartphones
0.35
with
without
10.31
0.46
1.50
1.80
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts
1000
150V AC for 1min.
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
30
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Socket
60
0.6mm
AXF5
BOARD-TO-FPC
Wearable devices, Smartphones
0.35
with
without
13.00
0.59
1.70
2.00
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts
1000
150V AC for 1min.
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
30
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Socket
50
0.6mm
AXF5
BOARD-TO-FPC
Wearable devices, Smartphones
0.35
with
without
11.25
0.59
1.70
2.00
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.4A/pin contact (power terminal)
0.30A/pin contact (signal terminal): Max. 2A at total pin contacts
1000
150V AC for 1min.
Max. 30mΩ (power terminal)
Max. 90mΩ (signal terminal)
30
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces

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