MIPTEC 3D Packaging Technology

Three-dimensional injection molded circuit components use MID (Molded Interconnect Device) technology. Further advancements use proprietary surface activation technology and laser patterning. The result is a 3D circuit device with a fine circuit pattern for mounting bare chips. Custom shapes and patterns are produced on an order request basis.

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Series table for lineup MIPTEC 3D Packaging Technology
Series/TypeDatasheet