Part Number List

Results 32
Models table for series A35S(0.35mm pitch)
Part No.DatasheetSocket/HeaderNumber of pinsMated height (mm)Family Name (Head of product No.)TypeApplicationsTerminal pitch (mm)Soldering terminalsPositioning bossesBody length (mm)Body Height (mm)Short widthRecommended PC board pattern Width (mm)Molded portion materialContact and Post MaterialSurface treatment materialRated CurrentInsulation resistance (Min. MΩ)(Initial)Dielectric strengthContact Resistance (mΩ max.)Insertion and removal life (times)Packing QuantityPacking quantity; Inner carton (pcs.)Packing quantity; Outer carton (pcs.)
Socket
34
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
8.30
0.77
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
10
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
3.40
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
64
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
12.85
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Socket
10
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
4.10
0.77
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Socket
50
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
11.10
0.77
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
30
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
6.90
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Socket
24
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
6.55
0.77
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
40
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
8.65
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
80
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
15.65
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
12
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, tablet PC and other mobile devices
0.35
with
without
3.75
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces