Part Number List

Results 12
Models table for series P35S(0.35mm pitch)
Part No.DatasheetSocket/HeaderNumber of pinsMated height (mm)Family Name (Head of product No.)TypeApplicationsTerminal pitch (mm)Soldering terminalsPositioning bossesBody length (mm)Body Height (mm)Short widthRecommended PC board pattern Width (mm)Molded portion materialContact and Post MaterialSurface treatment materialRated CurrentInsulation resistance (Min. MΩ)(Initial)Dielectric strengthContact Resistance (mΩ max.)Insertion and removal life (times)Packing QuantityPacking quantity; Inner carton (pcs.)Packing quantity; Outer carton (pcs.)
Header
50
1.5mm
AXT2
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
10.48
1.24
2.35
2.95
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Socket
60
1.5mm
AXT1
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
13.05
1.45
3.60
4.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Socket
70
1.5mm
AXT1
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
14.80
1.45
3.60
4.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Socket
100
1.5mm
AXT1
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
20.05
1.45
3.60
4.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Header
80
1.5mm
AXT2
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
15.73
1.24
2.35
2.95
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Socket
80
1.5mm
AXT1
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
16.55
1.45
3.60
4.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Header
100
1.5mm
AXT2
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
19.23
1.24
2.35
2.95
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Socket
40
1.5mm
AXT1
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
9.55
1.45
3.60
4.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Socket
50
1.5mm
AXT1
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
11.30
1.45
3.60
4.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces
Header
60
1.5mm
AXT2
BOARD-TO-BORAD, BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
12.23
1.24
2.35
2.95
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
50
EMBOSSED TAPE AND PLASTIC REEL
3,000 pieces (1-reel)
6,000 pieces