Part Number List

Results 34
Models table for series A4US(0.4mm pitch)
Part No.DatasheetSocket/HeaderNumber of pinsMated height (mm)Family Name (Head of product No.)TypeApplicationsTerminal pitch (mm)Soldering terminalsPositioning bossesBody length (mm)Body Height (mm)Short widthRecommended PC board pattern Width (mm)Molded portion materialContact and Post MaterialSurface treatment materialRated CurrentInsulation resistance (Min. MΩ)(Initial)Dielectric strengthContact Resistance (mΩ max.)Insertion and removal life (times)Packing QuantityPacking quantity; Inner carton (pcs.)Packing quantity; Outer carton (pcs.)
Socket
16
0.6mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
5.70
0.59
2.20
2.60
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Header
50
0.8mm
AXE2
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
11.80
0.65
1.80
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Header
34
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
8.60
0.65
1.80
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Header
36
0.8mm
AXE2
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
9.00
0.65
1.80
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Socket
36
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
9.70
0.77
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Socket
34
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
9.30
0.77
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Header
50
0.6mm
AXE2
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
11.80
0.46
1.28
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Socket
24
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
7.30
0.77
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Socket
80
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
18.50
0.77
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces
Socket
14
0.8mm
AXE1
BOARD-TO-FPC
Smartphones, laptops and other mobile devices
0.4
with
without
5.30
0.77
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.30A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
90
30
EMBOSSED TAPE AND PLASTIC REEL
10,000 pieces (1-reel)
20,000 pieces