Y2B(0.2mm pitch)

Models table for series Y2B(0.2mm pitch)
Part No.	Terminal Pitch (mm)	Number of Pins	Body Height (mm)	Family Name (Head of Product No.)	Lock Structure	Type	Applications	Contact Pitch (mm)	Soldering Terminals	FPC Holding Contacts	Contact Direction	Body Length (mm)	Recommended PC Board Pattern Width (mm)	Molded Portion Material	Contact and Post Material	Surface Treatment Material	Rated Current	Insulation Resistance (Min. MΩ)(Initial)	Dielectric Strength	Contact Resistance (M&Omega: Max.)	Insertion and Removal Life (Times)	Packing Quantity	Packing Quantity; Inner Carton (Pcs.)	Packing Quantity; Outer Carton (Pcs.)
AYF215135	0.4	51	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	11.80	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AYF213135	0.4	31	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	7.80	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AYF214135	0.4	41	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	9.80	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AYF212335	0.4	23	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	6.20	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AYF216135	0.4	61	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	13.80	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces

Models table for series Y2B(0.2mm pitch)
Part No.	Terminal Pitch (mm)	Number of Pins	Body Height (mm)	Family Name (Head of Product No.)	Lock Structure	Type	Applications	Contact Pitch (mm)	Soldering Terminals	FPC Holding Contacts	Contact Direction	Body Length (mm)	Recommended PC Board Pattern Width (mm)	Molded Portion Material	Contact and Post Material	Surface Treatment Material	Rated Current	Insulation Resistance (Min. MΩ)(Initial)	Dielectric Strength	Contact Resistance (M&Omega: Max.)	Insertion and Removal Life (Times)	Packing Quantity	Packing Quantity; Inner Carton (Pcs.)	Packing Quantity; Outer Carton (Pcs.)
AYF215135	0.4	51	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	11.80	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AYF213135	0.4	31	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	7.80	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AYF214135	0.4	41	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	9.80	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AYF212335	0.4	23	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	6.20	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AYF216135	0.4	61	0.90	AYF2	Back lock	FPC	Smartphones, DSC, Mobile devices	0.2	without	without	Top and bottom contact	13.80	3.15	Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.2A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	100	20	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces