Specifications
Item | Performance characteristics |
---|---|
Terminal Pitch (mm) | 0.6 |
Number of Pins | 11 |
Body Height (mm) | 0.90 |
Family Name (Head of Product No.) | AYF3 |
Lock Structure | Back lock |
Type | FPC |
Applications | Smartphones, DSC, Mobile devices |
Contact Pitch (mm) | 0.3 |
Soldering Terminals | without |
FPC Holding Contacts | without |
Contact Direction | Top and bottom contact |
Body Length (mm) | 4.80 |
Recommended PC Board Pattern Width (mm) | 3.15 |
Molded Portion Material | Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) |
Contact and Post Material | Copper alloy |
Surface Treatment Material | Base: Ni plating, Surface: Au plating |
Rated Current | 0.2A/pin contact |
Insulation Resistance (Min. MΩ)(Initial) | 1000 |
Dielectric Strength | 150V AC for 1min. |
Contact Resistance (M&Omega: Max.) | 100 |
Insertion and Removal Life (Times) | 20 |
Packing Quantity | EMBOSSED TAPE AND PLASTIC REEL |
Packing Quantity; Inner Carton (Pcs.) | 5,000 pieces (1-reel) |
Packing Quantity; Outer Carton (Pcs.) | 10,000 pieces |
Stock check
AYF331135
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