Specifications

Specifications table for model AYF331135
ItemPerformance characteristics
Terminal Pitch (mm)0.6
Number of Pins11
Body Height (mm)0.90
Family Name (Head of Product No.)AYF3
Lock StructureBack lock
TypeFPC
ApplicationsSmartphones, DSC, Mobile devices
Contact Pitch (mm)0.3
Soldering Terminalswithout
FPC Holding Contactswithout
Contact DirectionTop and bottom contact
Body Length (mm)4.80
Recommended PC Board Pattern Width (mm)3.15
Molded Portion Material Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Contact and Post MaterialCopper alloy
Surface Treatment Material Base: Ni plating, Surface: Au plating
Rated Current0.2A/pin contact
Insulation Resistance (Min. MΩ)(Initial)1000
Dielectric Strength150V AC for 1min.
Contact Resistance (M&Omega: Max.)100
Insertion and Removal Life (Times)20
Packing QuantityEMBOSSED TAPE AND PLASTIC REEL
Packing Quantity; Inner Carton (Pcs.) 5,000 pieces (1-reel)
Packing Quantity; Outer Carton (Pcs.)10,000 pieces

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Model image for AYF331135

AYF331135

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