Specifications
| Item | Performance characteristics |
|---|---|
| Terminal Pitch (mm) | 0.6 |
| Number of Pins | 11 |
| Body Height (mm) | 0.90 |
| Family Name (Head of Product No.) | AYF3 |
| Lock Structure | Back lock |
| Type | FPC |
| Applications | Smartphones, DSC, Mobile devices |
| Contact Pitch (mm) | 0.3 |
| Soldering Terminals | without |
| FPC Holding Contacts | without |
| Contact Direction | Top and bottom contact |
| Body Length (mm) | 4.80 |
| Recommended PC Board Pattern Width (mm) | 3.15 |
| Molded Portion Material | Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0) |
| Contact and Post Material | Copper alloy |
| Surface Treatment Material | Base: Ni plating, Surface: Au plating |
| Rated Current | 0.2A/pin contact |
| Insulation Resistance (Min. MΩ)(Initial) | 1000 |
| Dielectric Strength | 150V AC for 1min. |
| Contact Resistance (M&Omega: Max.) | 100 |
| Insertion and Removal Life (Times) | 20 |
| Packing Quantity | EMBOSSED TAPE AND PLASTIC REEL |
| Packing Quantity; Inner Carton (Pcs.) | 5,000 pieces (1-reel) |
| Packing Quantity; Outer Carton (Pcs.) | 10,000 pieces |
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AYF331135
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