Low Dk Bonding Sheet 

R-BM17

Suitable for replacing coaxial cable with a multi-layer flexible liquid crystal polymer (LCP) Printed Circuit Board. Contributes to higher speed and lower loss performance while enabling thinner structures.

Series image for Felios BM

Felios BM

Part number list

Results 1
Models table for series Felios BM
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
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17-19
17-19
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-
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3.3 Test method: Cavity resonance
2.9(19GHz)
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0.002 Test method: Cavity resonance
0.002(19GHz)
0.04 Test method: Internal method
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1.0(ED:18μm)
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0.05mm
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