Felios BM

Low Dk Bonding Sheet

R-BM17

Suitable for replacing coaxial cable with a multi-layer flexible liquid crystal polymer (LCP) Printed Circuit Board. Contributes to higher speed and lower loss performance while enabling thinner structures.

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Models table for series Felios BM
Part No.	Datasheet	Tg (DSC) (°C)	Tg (TMA), (°C)	Tg (DMA) (°C)	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-X,	CTE-Y,	CTE-Z	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dk at 1 GHz	Dk at 10 GHz	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-BM17		-	-	-	-	-	-	17-19	17-19	-	-	-	-	-	-	3.3 Test method: Cavity resonance	2.9(19GHz)	-	0.002 Test method: Cavity resonance	0.002(19GHz)	0.04 Test method: Internal method	-	-	1.0(ED:18μｍ)	-	0.05ｍｍ

Models table for series Felios BM
Part No.	Datasheet	Tg (DSC) (°C)	Tg (TMA), (°C)	Tg (DMA) (°C)	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-X,	CTE-Y,	CTE-Z	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dk at 1 GHz	Dk at 10 GHz	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-BM17		-	-	-	-	-	-	17-19	17-19	-	-	-	-	-	-	3.3 Test method: Cavity resonance	2.9(19GHz)	-	0.002 Test method: Cavity resonance	0.002(19GHz)	0.04 Test method: Internal method	-	-	1.0(ED:18μｍ)	-	0.05ｍｍ

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