Felios BM

Low Dk Bonding Sheet 

R-BM17

Suitable for replacing coaxial cable with a multi-layer flexible liquid crystal polymer (LCP) Printed Circuit Board. Contributes to higher speed and lower loss performance while enabling thinner structures.

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Felios BM

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Models table for series Felios BM
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
R-BM17
-
-
-
-
-
-
17-19
17-19
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-
-
-
-
-
3.3 Test method: Cavity resonance
2.9(19GHz)
-
0.002 Test method: Cavity resonance
0.002(19GHz)
0.04 Test method: Internal method
-
-
1.0(ED:18μｍ)
-
0.05ｍｍ

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