Hiper D

Highly Heat-Resistant Multi-Layer Circuit Board Materials

Laminate R-1755D/Prepreg R-1650D

With a Tg of 163^oC (DSC) and excellent CAF resistance, these materials are ideal for harsh usage environments. They are compatible with lead-free soldering processes and offer excellent laminate processability.

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Models table for series Hiper D
Part No.	Datasheet	Tg (DSC) (°C)	Tg (TMA), (°C)	Tg (DMA) (°C)	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-X, <Tg (ppm/℃)	CTE-Y <Tg (ppm/℃)	CTE-Z <Tg (ppm/℃)	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dk at 1 GHz	Dk at 10 GHz	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-1755D/R-1650D		163	154	185	345	-	15	10-12	12-14	43	236	0.63	1 x 10⁹	1 x 10⁸	4.4	-	-	0.016	-	-	0.11	23	21	1.3	94V-0	0.8mm

Models table for series Hiper D
Part No.	Datasheet	Tg (DSC) (°C)	Tg (TMA), (°C)	Tg (DMA) (°C)	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-X, <Tg (ppm/℃)	CTE-Y <Tg (ppm/℃)	CTE-Z <Tg (ppm/℃)	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dk at 1 GHz	Dk at 10 GHz	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-1755D/R-1650D		163	154	185	345	-	15	10-12	12-14	43	236	0.63	1 x 10⁹	1 x 10⁸	4.4	-	-	0.016	-	-	0.11	23	21	1.3	94V-0	0.8mm

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