Impact-Resistant Underfill
With high ductility, this Impact-Resistant Underfill features improved crack resistance to reinforce solder joints. It has high drop impact resistance and is good for large scale integration (LSI) packages and Solid-State Drives (SSD) in laptops, digital cameras, mobile phones, smartphones and tablets.
Impact-Resistant Underfill
Part number list
Results 0
Part No. | Datasheet |
---|
Resources
Filter by:
Showing 0 to 0 of 0 results
Results0
What's New