Low-Temperature-Cure Underfill

Used for mounting reinforcement of sensitive parts that need to be protected from high temperatures during assembly, this unique Underfill cures at a low temperature of 80℃. After curing, the Tg is over 140℃. This combination of low curing temperature and high Tg mitigates heat shrinkage stresses common with other Underfills. Exhibiting high flowability, this product can flow up to 40 mm in a 20μm gap.