Panasonic Has Developed A Wide Range Of Semiconductor Encapsulation Materials For Laminate-Based Packaging Designs 

From leading-edge Molded Underfills (MUF) to Epoxy Mold Compounds (EMC) for transfer and compression molding, Panasonic materials for laminate packages offer an unmatched combination of performance, processability and reliability.

The engineers with Panasonic R&D regularly develop variations of current materials to meet specific encapsulation requirements. We're ready to discuss your specific requirements.