CO2 / FAYb Laser Markers: Compact CO2 Laser Marker LP-GS

Model List

Found 10 matches. Display 1 - 10 matches.
Part No.sort descendingData SheetMarking laser : Laser typeMarking laser : Average outputMarking laser : Laser oscillationGuide LaserLaser pointerScanning methodMarking rangeWork distance : center positionWork distance rangeScan speedParts Inventory
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design engineersPanasonicLP-GS051-L
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
n/aMaximum 2,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051-LE
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
n/aMaximum 2,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
108 to 114 mm 4.252 to 4.488 inMaximum 3,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051-E
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
108 to 114 mm 4.252 to 4.488 inMaximum 3,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051-FN
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
108 to 114 mm 4.252 to 4.488 inMaximum 3,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051-LF
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
n/aMaximum 2,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051-LFE
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
n/aMaximum 2,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051-F
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
108 to 114 mm 4.252 to 4.488 inMaximum 3,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051-FE
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
108 to 114 mm 4.252 to 4.488 inMaximum 3,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.
design engineersPanasonicLP-GS051-LFN
CO2 laser, Wavelength: 10,600 nm 0.417 mils, Class 4 laser5 W
(Note)Output at product processing edge (at configured power of 100) .
CW oscillationRed semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Red semiconductor laser, Wavelength: 655 nm 0.026 mil, Class 2 laser
Maximum output: 1 mW or less
Galvano-scanning method55 x 55 mm 1.181 in x 1.181 in111 mm 2.795 in
(Note)There is an approx. ±0.5 mm 0.020 in individual difference in work distance center position.
n/aMaximum 2,000 mm / sec. 118.110 in/sec.
(Note)Values listed here are the variable range. Setting values that can maintain marking or processing quality differ based on marking conditions and target materials.