Wafer Mapping Sensor M-DW1

To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.


  • Precise Position Detection
  • Red Light LED With Fixed Focus Reflective Beam
  • High-Speed Response Time: 0.5ms
  • Off-Delay Timer Selectable
  • Teach-In Adjustment Makes It User-Friendly
  • 4 Sensitivity Levels Are Adjustable Via DIP Switch Or External
  • Light ON/Dark ON

Part Number List

Results 1
Models table for series Wafer Mapping Sensor M-DW1
Part No.DatasheetCE Marking Directive ComplianceCenter Sensing DistanceSensing Object Detectable SurfaceSensing AngleWafer PitchSuitable CassetteSupply Voltage Current ConsumptionOutputOutput: Output Operation Output: Short-Circuit ProtectionResponse TimeOperation Indicator Stability IndicatorTimer Function Test Input (Emission Halt Input) Sensitivity Selection Input Sensitivity SettingAmbient TemperatureAmbient HumidityAmbient IlluminanceVoltage WithstandabilityInsulation Resistance Vibration ResistanceShock ResistanceEmitting ElementMaterialCableCable ExtensionWeight (Typ.)
EMC Directive, RoHS Directive
45 mm 1.772 in
3 inch or larger semiconductor wafer
(Note:In case of 8 inch or less wafers, the wafer pitch, the orientation flat or surface condition may affect the sensing.)
Surface having a side edge which reflects light in the light receiving direction
(Note:Polished wafers, etc., which have a sharp edge cannot be detected since they do not reflect the light in the light receiving direction.)
12.5 ± 5°
(Note:Since the position of the orientation flat may vary by ±20° due to its rotation.)
Separate sensing is possible at normal sensitivity for 3 mm 0.118 in pitch or more
(Note:This is the pitch of an 8 inch wafer near its center region when it is inserted in an inclined fashion. When detecting a wafer having an orientation flat, the wafer pitch becomes still smaller when sensing at positions which avoid the orientation flat. In this case, the sensing signal cannot be resolved and it becomes a continuous, broad signal.)
SEMI standard FOUP cassette / open cassette
12 to 24 V DC ± 10 % Ripple P-P 10 % or less
65 mA or less
NPN output / PNP output, selectable with output selection switch

NPN open-collector transistor
- Maximum sink current: 100 mA
- Applied voltage: 30 V DC or less (between output and 0 V)
- Residual voltage: 1 V or less (at 100 mA sink current)
0.4 V or less (at 16 mA sink current)

PNP open-collector transistor
- Maximum source current: 100 mA
- Applied voltage: 30 V DC or less (between output and +V)
- Residual voltage: 1 V or less (at 100 mA source current)
0.4 V or less (at 16 mA source current)
Light-ON / Dark-ON, selectable by switch
Incorporated (restored automatically)
500 μs or less
Orange LED (lights up when the output is ON)
Green LED (lights up under stable light received condition or stable dark condition)
Approx. 2 ms fixed OFF-delay timer, switchable either effective or ineffective
Signal condition
- Emission Halt: Open, or 4 to 8 V
- Emission: 0 to 3 V, or 9 V to +V (26.4 V max.)
Signal condition
- Input OFF: Open, or 4 to 8 V
- Input ON: 0 to 3 V, or 9 V to +V (26.4 V max.)
Back surface teaching: effectuated with sensor's sensitivity setting button
Detection sensitivity selection: 4 levels with sensor's 2 bit switch or 2 levels with external input selectable
0 to +55 ℃ +32 to +131 ℉ (No dew condensation), Storage: -10 to +70 ℃ +14 to +158 ℉
35 to 85 % RH, Storage: 35 to 85 % RH
Incandescent light: 3,000 lx or less at the light-receiving face,
Fluorescent light: 1,500 lx or less at the light-receiving face
1,000 V AC for one min. between all supply terminals connected together and enclosure
20 MΩ, or more, with 250 V DC megger between all supply terminals connected together and enclosure
10 to 500 Hz frequency, 3 mm 0.118 in double amplitude in X, Y and Z directions for two hours each
98 m/s2 acceleration (10 G approx) in X, Y and Z directions five times each
LED (modulated)
Enclosure: ABS and Stainless steel (SUS301), Lens: Acrylic
0.15 mm2 5-core cabtyre cable, 300 mm 11.811 in long
Extension up to total 10 m 32.808 ft is possible with 0.15 mm2, or more, cable.
Net weight: 75 g approx.