Anti-Sulfurated Thick Film Chip Resistors/ Anti-Surge Type

Higher Power, Anti-Surge Resistors For Challenging, Harsh Environments


Extremely durable in challenging or unclean, harsh environments, the ERJ-UP3, ERJ-UP6 and ERJ-UP8  Series Resistors provide anti-sulfurization characteristics that avoid an open circuit caused by a sulfide disconnection.  High resistance to sulfurization is achieved through the use of an anti-sulfurated electrode structure and material in the manufacture of ERJ-UP3, ERJ-UP6 and ERJ-UP8  Series Resistors.

The ERJ-UP3, ERJ-UP6 and ERJ-UP8  Series Resistors are recommended for design in harsh or unclean environment applications where a device might be exposed to oil, gas or polluted soil.  AEC-Q200 Compliance and IEC 60115-8, JIS C 5201-8 and JEITA RC-2134C Reference Standards for the entire ERJ-UP3, ERJ-UP6 and ERJ-UP8  Series of Anti-Sulfulrated Thick Film Chip Resistors from Panasonic ensures optimal quality and reliability.

Features

  • Anti-Sulfurization And Anti-Surge Characteristics
  • High Resistance To Sulfurization Achieved By Adopting Anti-Sulfurated Electrode Material
  • High Reliability: Metal Glaze Thick Film Resistive Element And Three Layers Of Electrodes
  • ESD Surge Characteristics Superior To Standard Metal Film Resistors
  • Ag-PD Based Inner Electrode And Structure
  • Resistance Tolerance: ±0.5%, ±1% and ±5%
  • Wide Operating Temperature: -55°C to +155°C
  • Suitable For Both Reflow And Flow Soldering
  • AEC-Q200 Compliant
  • RoHS / REACH Compliant
  • Reference Standards: EC 60115-8, JIS C 5201-8 and JEITA RC-2134C

Benefits

  • Solves Demands For Higher Power And Environmentally Durable Resistors
  • AEC-Q200 Compliance Ensures Strict Quality Control Standards Are Being Enforced
Series image for Anti-Sulfurated Thick Film Chip Resistors/ Anti-Surge Type

Anti-Sulfurated Thick Film Chip Resistors/ Anti-Surge Type

Part number list

Results 4072
Models table for series Anti-Sulfurated Thick Film Chip Resistors/ Anti-Surge Type
Part No.DatasheetPower Rating (W)Chip Size (LxW) (mm)Resistance Values (Ω)Resistance Tolerance (%)PackagingT.C.R (ppm/Cel)T.C.R (×10⁻⁶/°C)Weight (Typ.) (mg)
0.5
2.0 x 1.25 (EIA:0805)
1070000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1180000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1150000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1210000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1270000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1400000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1430000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1500000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1800000
1
Punched (Paper) Taping
+/-200
±200
4
0.5
2.0 x 1.25 (EIA:0805)
1690000
1
Punched (Paper) Taping
+/-200
±200
4