Panasonic provides small signal MOSFETs featuring small size, low-on resistance (low RDS (on)), and low voltage drive, which also include CSP (Chip Size Package) series (Now sampling) with high current efficiency, allowing small, low-profile, low-power smartphones or other mobile equipment.
MOSFETs: Small Signal MOSFETs
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Low Voltage Drive
Compact and Array packages
Lineup of CSP products
Features of CSP products
Industry's lowest(*1) on-resistance (60% lower than previous model) with CSP
*FJ4B011 series: Improved to 68mΩ at VGS = 2.5 V (Our previous MTM86127: 170mΩ)
The gate-source voltage, VGS = 1.5 V with CSP (Our previous MTM86127: VGS = 2.5 V)
Industry's smallest (*1) footprint and lowest profile
*FJ4B011 series: 71% smaller and 80% thinner than our previous MTM86127
(*1) As of March 25, 2013
CSP (Chip Size Package)
A chip-sized package achieved by removing mold resin, lead frame, solder paste, and gold wire from traditional resin package, and by improving the internal structure.
CSP Products *As of March 25, 2013
N/P channel MOSFETs with CSP, which feature low on-resistance, low voltage drive (VGS = 1.5 V), and low profile (0.1 mm).