The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. This year's event has been converted to an online format, with all presentations available, free of charge, during the month of June.
Panasonic will be presenting during two sessions in conjunction with the Georgia Institute of Technology.
Panasonic has developed a novel low-stress dielectric film (PLSF) for semiconductor packaging. This new polymer film significantly improves package-level warpage performance, enabling the fabrication of large Multi-Chip Modules (MCM).
This presentation demonstrates the fabrication of a 5 μm lines and spaces (5/5 L/S) redistribution layer (RDL) as well as 7 μm microvias using the Panasonic film. It will also present warpage and residual stress data of the PLSF at various stages of fabrication along with preliminary results of a thermal cycling test.
Panasonic has developed a high permeability magnetic material for high-density embedded inductors for Integrated Voltage Regulators (IVRs). This presentation demonstrates novel embedded toroidal inductors, fabricated using Panasonic's magnetic material, along with process feasibility and measurements.