The Electronic Components and Technology Conference (ECTC) is the premier international conference that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. It is an online format again this year, with presentations available during the month of June.
Panasonic will be presenting two technical papers: one detailing independent IC substrate research by Panasonic R&D and one in conjunction with the Georgia Institute of Technology covering magnetic materials for IC packaging.
(Presented in Session 17: The Latest Trends in Fan-Out Packaging and Substrate Technology)
Panasonic researchers have developed a novel core material to address the trade-off between substrate warpage and assembly-level reliability for flip-chip BGA packages. Through research and simulation, they identified the optimal properties for a new core material that would enable the balance between warpage and assembly level reliability. They formulated and tested a new core material to meet these targets. The evaluation results confirmed the ability of the new material to reduce package warpage while concurrently improving assembly reliability.
(Presented in Session 29: 3D Power Components and Power Integrity)
Next-generation high-performance computing (HPC) platforms run at higher speed with higher power consumption levels. Integrated voltage regulators (IVR) with a conversion ratio of 12 V to 1 V can help to reduce the power distribution network (PDN) impedance, increase the voltage conversion efficiency, and increase the regulation bandwidth. This paper presents a new package embedded inductor array for multi-phase IVRs with a DC resistance as low as 22.8 mΩ as well as demonstrates inductors with three magnetic materials.