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Panasonic Electronic Materials Presents Two Technical Papers at ECTC 2022

The Electronic Components and Technology Conference (ECTC) is the premier international conference that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The conference runs May 31 - June 3, 2022 in San Diego, CA.

Panasonic will be presenting two technical papers: one on IC substrate material development for 5G applications and another in conjunction with the Georgia Institute of Technology on the fabrication of package embedded inductors for integrated voltage regulators.

Paper #1 - Low-Dielectric, Low-Profile IC Substrate Material Development for 5G Applications

As 5G communication systems continue to be developed and deployed worldwide, the processing performance of the semiconductors that underpin this technology increases rapidly. With concurrent changes in form factors of 5G-enabled mobile devices -- smartphones and tablets -- customers demand ever thinner, smaller, lighter devices with increased functionality.

The countervailing trends of reduced semiconductor package size against increased processing speed and I/O count of encased chips present distinct technical challenges. Panasonic is developing a low dielectric resin-coated copper (RCC) as a new substrate material for 5G packages with the objective of improving electrical performance while reducing thickness. This paper and presentation describes the development process, the electrical, mechanical and physical testing data, as well as processing and multilayer formation testing for this new RCC material.

Paper #2 - Fabrication and Characterization of Package Embedded Inductors for Integrated Voltage Regulators

Data center electricity consumption is increasing dramatically and this trend is projected to continue, underpinning the need to increase energy efficiency of power delivery networks (PDNs) in these centers. Current efficiencies for the 48 V to 1 V multi-stage conversion systems can be as low as 75% or lower because of multiple down-conversion stages and high current passing through the mother board. This research included four magnetic materials, supplied by Panasonic, to fabricate and test PCB-embedded inductor designs with the aim of achieving increased conversion efficiency.



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