Specifications

Specifications table for model AXG3A1012
ItemPerformance characteristics
Socket/HeaderSocket
Number of Pins10
Mated Height (mm)0.6mm
Packing Quantity; Inner Carton (Pcs.) 15,000 pieces (1-reel)
Packing Quantity; Outer Carton (Pcs.)30,000 pieces
TypeBOARD-TO-FPC
Piece Type2 Pieces type (Socket)
ApplicationsSmartphones, Tablet PCs, Laptops, Router
Terminal Pitch (mm)0.35
Packing QuantityEMBOSSED TAPE AND PLASTIC REEL
Soldering Terminalswith
Positioning Bosseswithout
Body Length (mm)3.69
Body Height (mm)0.53
Short Width 2.44
Recommended PC Board Pattern Width (mm)2.47
Rated CurrentMax. 0.3 A / pin contact x 8 pin contacts (signal contact)
Max. 1.0 A / pin contact x 2 pin contacts (power contact)
Dielectric Strength150V AC for 1min.
Insulation Resistance (Min. MΩ)(Initial)1000
Contact Resistance (M&Omega: Max.)Max. 90mΩ
Insertion and Removal Life (Times)10
Molded Portion Material LCP resin (UL94V-0)
Contact and Post MaterialCopper alloy
Surface Treatment Material Base: Ni plating Surface: Au plating
Short width (mm)2.44

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AXG3A1012

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