CF1 Series Board-to-FPC Automotive Connector

Lightweight 50 V DC Connectors Suitable for Harsh Automotive Applications with High Shock, High Vibration, and 125°C High Heat Resistance Requirements

The demand for FPC cables within automotive devices is increasing, such as instrument panels, steering switches, rear lamps, shift levers, side mirrors, headlamps, and battery management systems. Automotive applications have a growing trend to reduce the overall weight and avoid operator wiring failures caused by electrical wire connections.

Panasonic has developed the CF1 Series Board-to-FPC solution for this purpose. The CF1 Series Board-to-FPC connection has a 125°C heat resistance and necessary vibration characteristics suitable for the automotive and transportation market. A significant benefit is that these new Automotive Connectors can be directly connected without requiring any relay wiring harnesses when connected with FPC cables and boards for battery management systems. Panasonic's CF1 Series Automotive Connectors preserve contact reliability using a double-sided clip contact structure. 

Panasonic's CF1 Series Connectors have an Inertia lock construction to prevent half-mating for the 4-pin type. An "anti-misoperation bridge structure" also contains the unintended operation of the mating lock. The CF1 Series design also allows reflow soldering of the plug assembly to be performed simultaneously with other Surface Mount Devices without other processes where competing devices require a manual connection.

Feature and Benefits

  • Number of Pins: 4, 6, 10
  • Rated Current: 2.0A/Pin Contact
  • Rated Voltage: 50 V DC
  • Heat Resistance Up To 125°C and Strong Mechanical Shock and Vibration Resistance Using Double-Sided Clip Contact Structure  
  • Suitable for Harsh Automotive Applications That Require High Shock, High Vibration, and Ability to Withstand High Temperatures 
  • Simple and Lightweight Solution and Easy FPC and Board Connections Without Relay Wiring Harnesses 
  • Reflow Compatible for Simplified Assembly Process
  • Anti-Misoperation Bridge Structure Prevents Unintended Operation of Mating Lock

 

Part Number List

Results 6
Models table for series CF1 Series Board-to-FPC Automotive Connector
Part No.DatasheetNumber of PinsPacking Quantity; Inner Carton (Pcs.) Packing Quantity; Outer Carton (Pcs.)TypePackaging specificationsRated CurrentRated VoltageDielectric StrengthInsulation ResistanceContact ResistanceInsertion forceRemoval forceHousing lock forceTemperature and humidity of ambient storage and transportationInsertion and removal lifeMaterial and surface treatment
4
800 pieces (1-reel)
1,600 pieces
BOARD-TO-FPC
EMBOSSED TAPE AND PLASTIC REEL
2.0 A/pin contact
50 V DC
1,000 V AC for 1 min
Min. 100 MΩ
Max. 20 mΩ (Initial)
Max. 40 mΩ (after test)
Max. 36.0 N (Initial stage)
Max. 18.0 N (Initial stage)
Min. 50 N (Initial stage)
-40 to +125°C (Including temperature rise when applying current)
(Storage and transportation temperature is -40 to 50 °C in a packing state.)
10 times (Contact resistance: Max. 40 mΩ)
[Body]
Material: LCP resin (UL94V-0)
Color: Black

[Post]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Contact , Soldering)

[Metal tab]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Soldering portion)
6
800 pieces (1-reel)
1,600 pieces
BOARD-TO-FPC
EMBOSSED TAPE AND PLASTIC REEL
2.0 A/pin contact
50 V DC
1,000 V AC for 1 min
Min. 100 MΩ
Max. 20 mΩ (Initial)
Max. 40 mΩ (after test)
Max. 36.0 N (Initial stage)
Max. 23.0 N (Initial stage)
Min. 50 N (Initial stage)
-40 to +125°C (Including temperature rise when applying current)
(Storage and transportation temperature is -40 to 50 °C in a packing state.)
10 times (Contact resistance: Max. 40 mΩ)
[Body]
Material: LCP resin (UL94V-0)
Color: Black

[Post]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Contact , Soldering)

[Metal tab]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Soldering portion)
10
800 pieces (1-reel)
1,600 pieces
BOARD-TO-FPC
EMBOSSED TAPE AND PLASTIC REEL
2.0 A/pin contact
50 V DC
1,000 V AC for 1 min
Min. 100 MΩ
Max. 20 mΩ (Initial)
Max. 40 mΩ (after test)
Max. 36.0 N (Initial stage)
Max. 33.0 N (Initial stage)
Min. 50 N (Initial stage)
-40 to +125°C (Including temperature rise when applying current)
(Storage and transportation temperature is -40 to 50 °C in a packing state.)
10 times (Contact resistance: Max. 40 mΩ)
[Body]
Material: LCP resin (UL94V-0)
Color: Black

[Post]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Contact , Soldering)

[Metal tab]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Soldering portion)
4
800 pieces (1-reel)
1,600 pieces
BOARD-TO-FPC
EMBOSSED TAPE AND PLASTIC REEL
2.0 A/pin contact
50 V DC
1,000 V AC for 1 min
Min. 100 MΩ
Max. 20 mΩ (Initial)
Max. 40 mΩ (after test)
Max. 36.0 N (Initial stage)
Max. 18.0 N (Initial stage)
Min. 50 N (Initial stage)
-40 to +125°C (Including temperature rise when applying current)
(Storage and transportation temperature is -40 to 50 °C in a packing state.)
10 times (Contact resistance: Max. 40 mΩ)
[Housing]
Material: LCP resin (UL94V-0)
Color: Black

[Contact]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Contact, Soldering)

[Metal tab]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Soldering)
10
800 pieces (1-reel)
1,600 pieces
BOARD-TO-FPC
EMBOSSED TAPE AND PLASTIC REEL
2.0 A/pin contact
50 V DC
1,000 V AC for 1 min
Min. 100 MΩ
Max. 20 mΩ (Initial)
Max. 40 mΩ (after test)
Max. 36.0 N (Initial stage)
Max. 33.0 N (Initial stage)
Min. 50 N (Initial stage)
-40 to +125°C (Including temperature rise when applying current)
(Storage and transportation temperature is -40 to 50 °C in a packing state.)
10 times (Contact resistance: Max. 40 mΩ)
[Housing]
Material: LCP resin (UL94V-0)
Color: Black

[Contact]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Contact, Soldering)

[Metal tab]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Soldering)
6
800 pieces (1-reel)
1,600 pieces
BOARD-TO-FPC
EMBOSSED TAPE AND PLASTIC REEL
2.0 A/pin contact
50 V DC
1,000 V AC for 1 min
Min. 100 MΩ
Max. 20 mΩ (Initial)
Max. 40 mΩ (after test)
Max. 36.0 N (Initial stage)
Max. 23.0 N (Initial stage)
Min. 50 N (Initial stage)
-40 to +125°C (Including temperature rise when applying current)
(Storage and transportation temperature is -40 to 50 °C in a packing state.)
10 times (Contact resistance: Max. 40 mΩ)
[Housing]
Material: LCP resin (UL94V-0)
Color: Black

[Contact]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Contact, Soldering)

[Metal tab]
Material: Copper alloy
Surface treatment: Sn plating over nickel (Soldering)

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