Y3B Series (0.3mm Pitch)

The Panasonic Y3B Series Connectors are 0.3mm Pitch Connectors used to secure FPC/FFC with a locking lever. These Connectors use a back lock type construction which contributes to a slim design of 3.15mm width. Additionally, a low profile design of 0.9mm height also facilitates device miniaturization.

The use of double top and bottom contacts construction allows for an improvement of mechanical design flexibility and eliminates the need of using different Connectors (with either top or bottom contacts) depending on the FPC wiring conditions.

Y3B Series Connectors are also designed in a way that allows for wiring patterns to be placed under the Connector.

These Connectors are constructed with wall moldings on the four sides on the FPC inlet making positional displacement of the FPC/FFC less likely to occur during insertion.

The back lock construction eliminates the possibility of the lever from accidentally opening if the FPC is tilted upwards preventing a common failure mode. Additionally, the lever locking mechanism can also save time and effort on the assembly production line as the Connector is delivered with the lever already in the open position.

The terminals of the Y3B Series Connectors uses a nickel barrier with high resistance to solder creepage.

Part Number List

Results 24
Models table for series Y3B Series (0.3mm Pitch)
Part No.DatasheetTerminal Pitch (mm)Number of PinsBody Height (mm)Family Name (Head of Product No.)Lock StructureTypeApplicationsContact Pitch (mm)Soldering TerminalsFPC Holding ContactsContact DirectionBody Length (mm)Recommended PC Board Pattern Width (mm)Molded Portion Material Contact and Post MaterialSurface Treatment Material Rated CurrentInsulation Resistance (Min. MΩ)(Initial)Dielectric StrengthContact Resistance (M&Omega: Max.)Insertion and Removal Life (Times)Packing QuantityPacking Quantity; Inner Carton (Pcs.) Packing Quantity; Outer Carton (Pcs.)
0.6
13
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
5.40
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
23
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
8.40
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
51
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
16.80
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
25
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
with
Top and bottom contact
9.60
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
15
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
6.00
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
27
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
9.60
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
17
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
6.60
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
9
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
4.20
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
31
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
10.80
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
0.6
61
0.90
AYF3
Back lock
FPC
Smartphones, DSC, Mobile devices
0.3
without
without
Top and bottom contact
19.80
3.15
Housing: LCP resin (UL94V-0) Lever: LCP resin (UL94V-0)
Copper alloy
Base: Ni plating, Surface: Au plating
0.2A/pin contact (Max.12A at total contacts)
1000
150V AC for 1min.
100
20
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces

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