Hiper V

Highly Heat-Resistant Multi-Layer Circuit Board Materials

Laminate R-1755V/Prepreg R1650V

Works well with Panasonic’s MEGTRON Series in hybrid board constructions for automotive, measuring instrumentation or ICT infrastructure applications.
 
Excellent CAF resistance and ideal for lead-free assembly processes.

Series image for Hiper V

Hiper V

Part number list

Results 1
Models table for series Hiper V
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
R-1755V/R1650V
173
165
190
350
＞120
20
11-13
13-15
44
255
0.53
1 x 10⁹
1 x 10⁸
4.4
4.3
-
0.016
0.020
-
0.12
24
22
1.5
94V-0
0.8mm
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