| Tg (DSC) (°C) | 173 |
| Tg (TMA), (°C) | 165 |
| Tg (DMA) (°C) | 190 |
| Td (Thermal Decomposition) (°C) | 350 |
| T288 (Without Cu) (min) | ＞120 |
| T288 (With Cu) (min) | 20 |
| CTE-X, <Tg (ppm/℃) | 11-13 |
| CTE-Y <Tg (ppm/℃) | 13-15 |
| CTE-Z <Tg (ppm/℃) | 44 |
| CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | 255 |
| Thermal Conductivity, (W/m・K) | 0.53 |
| Volume Resistivity (MΩ・cm) | 1 x 10⁹ |
| Surface Resistivity (mΩ) | 1 x 10⁸ |
| Dk at 1 GHz | 4.4 |
| Dk at 10 GHz | 4.3 |
| Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | - |
| Df at 1 GHz | 0.016 |
| Df at 10 GHz | 0.020 |
| Df at 12 GHz | - |
| Water Absorption (%) | 0.12 |
| Flexural Warp (MD) (GPa) | 24 |
| Flexural Fill (TD) (GPa) | 22 |
| Peel Strength (1 Oz. Cu) (kN/m) | 1.5 |
| Flammability | 94V-0 |
| Sample Thickness (mm) | 0.8mm |
