Ultra High Speed Halogen Free for Power Amplifiers

Enabling 5G Networks - Panasonic’s Lowest Loss Circuit Laminate Ever!

Laminate R-5575 Prepreg R-5470

xpedion logo 150

 

 

High thermal conductivity + low transmission loss.

Ideal performance for 5G base station power amplifiers.

Low-transmission-loss multi-layer PCB materials, MEGTRON and XPEDION

Discover our top-of-the-line circuit board materials, MEGTRON and XPEDION, designed to provide high-speed, high-frequency, and stable operation for your networking equipment. With our innovative resin design, MEGTRON and XPEDION offer a low dielectric constant (Dk) and dissipation factor (Df) that ensures minimal transmission loss in your printed circuit boards. As your co-creation partner, we are committed to supporting your manufacturing needs with quality materials and contributing to the development of our society.

Part Number List

Results 1
Models table for series Ultra High Speed Halogen Free for Power Amplifiers
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, <Tg (ppm/℃)CTE-Y <Tg (ppm/℃) CTE-Z <Tg (ppm/℃)CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
-
205
245
440
-
>120
13-16
13-16
20
155
0.60

1 x 10⁹ 

1 x 10⁸
3.7
-
3.7
0.002
-
0.004
0.23
-
-
0.8 (Cu:RT)
94V-0
0.5mm

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