Low Dk Halogen Free Circuit Board Materials

High Density (HDI) Wiring For Mobile Devices And In-Cabin Automotive Applications

LaminateR-A555(W) /PrepregR-A550(W) 

Compatible with mSAP processing.

Series image for Low Dk Halogen Free Circuit Board Materials

Low Dk Halogen Free Circuit Board Materials

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Results 1
Models table for series Low Dk Halogen Free Circuit Board Materials
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
R-A555(W)/R-A550(W)
-
160
200
380
＞ 60
＞ 60
11-13
13-15
41
270
0.40

1 x 10⁹ 

1 x 10⁸
3.4 (RC:70%)
-
-
0.008 (RC:70%)
-
-
0.07
26
24
-
94V-0
0.8mm

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