Low Dk Halogen Free Circuit Board Materials

High Density (HDI) Wiring For Mobile Devices And In-Cabin Automotive Applications

LaminateR-A555(W) /PrepregR-A550(W)

Compatible with mSAP processing.

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Models table for series Low Dk Halogen Free Circuit Board Materials
Part No.	Datasheet	Tg (DSC) (°C)	Tg (TMA), (°C)	Tg (DMA) (°C)	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-X, <Tg (ppm/℃)	CTE-Y <Tg (ppm/℃)	CTE-Z <Tg (ppm/℃)	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dk at 1 GHz	Dk at 10 GHz	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-A555(W)/R-A550(W)		-	160	200	380	＞ 60	＞ 60	11-13	13-15	41	270	0.40	1 x 10⁹	1 x 10⁸	3.4 (RC:70%)	-	-	0.008 (RC:70%)	-	-	0.07	26	24	-	94V-0	0.8mm

Models table for series Low Dk Halogen Free Circuit Board Materials
Part No.	Datasheet	Tg (DSC) (°C)	Tg (TMA), (°C)	Tg (DMA) (°C)	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-X, <Tg (ppm/℃)	CTE-Y <Tg (ppm/℃)	CTE-Z <Tg (ppm/℃)	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dk at 1 GHz	Dk at 10 GHz	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-A555(W)/R-A550(W)		-	160	200	380	＞ 60	＞ 60	11-13	13-15	41	270	0.40	1 x 10⁹	1 x 10⁸	3.4 (RC:70%)	-	-	0.008 (RC:70%)	-	-	0.07	26	24	-	94V-0	0.8mm

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