MEGTRON 7

Ultra-low Loss, Highly Heat Resistant Circuit Board Materials.

LaminateR-5785(N)/Prepreg R-5680(N)

The ultra-low dielectric constant (Dk) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. 

The MEGTRON 7 family, including  MEGTRON 7(N), MEGTRON 7(GE) and MEGTRON 7(GN), is High Density Interconnect (HDI) technology compatible with very high layer count and large format printed Circuit Board (PCB) layouts.

Part Number List

Results 3
Models table for series MEGTRON 7
Part No.Datasheet Tg (DSC), Tg (TMA), (°C)Tg (DMA), Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-Y, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Poisson's Ratio Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) Flammability
200 °C
210 °C
400 °C
>120 min
>120 min
14-16 ppm/°C
14-16 ppm/°C
42 ppm/°C
280 ppm/°C
1 x 10⁹ MΩ · cm
1 x 10⁸ MΩ
3.63
3.61
0.002
0.003
0.06%
0.8 kN/m
94V-0
200 °C
210 °C
400 °C
>120 min
>120 min
14-16 ppm/°C
14-16 ppm/°C
42 ppm/°C
280 ppm/°C
1 x 10⁹ MΩ · cm
1 x 10⁸ MΩ
3.37
3.35
0.001
0.002
0.06%
0.8 kN/m
94V-0
200 °C
210 °C
400 °C
>120 min
>120 min
14-16 ppm/°C
14-16 ppm/°C
42 ppm/°C
280 ppm/°C
0.40 W/m · K
1 x 10⁹ MΩ · cm
1 x 10⁸ MΩ
3.4
3.4
0.001
0.002
0.06%
19 GPa
18 GPa
0.8 (Cu:H-VLP)
94V-0

What's New

Stay up to date