MEGTRON 7

Ultra-low Loss, Highly Heat Resistant Circuit Board Materials.

LaminateR-5785(N)/Prepreg R-5680(N)

The ultra-low dielectric constant (Dk) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G.

The MEGTRON 7 family, including MEGTRON 7(N), MEGTRON 7(GE) and MEGTRON 7(GN), is High Density Interconnect (HDI) technology compatible with very high layer count and large format printed Circuit Board (PCB) layouts.

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MEGTRON 7

Part number list

Results 5

Models table for series MEGTRON 7
Part No.	Tg (DSC),	Tg (TMA), (°C)	Tg (DMA),	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-Y	CTE-Z	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	CTE-Y,
R-5785(GN)/R-5680(GN)	200 °C	210 °C		400 °C	>120 min	>120 min	14-16 ppm/°C	42 ppm/°C	280 ppm/°C		1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.37		3.35	0.001		0.002	0.06%			0.8 kN/m	94V-0	14-16 ppm/°C
R-5785(N)/R-5680(N)	200 °C		210 °C	400 °C	>120 min	>120 min	14-16 ppm/°C	42 ppm/°C	280 ppm/°C	0.40 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4		3.4	0.001		0.002	0.06%	19 GPa	18 GPa	0.8 (Cu:H-VLP)	94V-0	14-16 ppm/°C
R-5785(GE)/R-5680(GE)	200 °C		210 °C	400 °C	>120 min	>120 min	14-16 ppm/°C	42 ppm/°C	280 ppm/°C		1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.63		3.61	0.002		0.003	0.06%			0.8 kN/m	94V-0	14-16 ppm/°C
R-578Y(N)	200 °C		210 °C	400 °C	> 120 min	> 120 min	14 - 16 ppm/°C	42 ppm/°C	280 ppm/°C		1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.37	3.31 @ 14 GHz		0.001	0.0023 @ 14 GHz		0.06			0.8	94V-0
R-578Y(G)	200 °C	190 °C	210 °C	400 °C	> 120 min	>120 min	14 - 16 ppm/°C	42 ppm/°C	280 ppm/°C		1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.63	3.60 @ 13 GHz		0.002	0.0034 @ 13 GHz		0.06			0.8	94V-0

Models table for series MEGTRON 7
Part No.	Tg (DSC),	Tg (TMA), (°C)	Tg (DMA),	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-Y	CTE-Z	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Df at 12 GHz	Water Absorption (%)	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	CTE-Y,
R-5785(GN)/R-5680(GN)	200 °C	210 °C		400 °C	>120 min	>120 min	14-16 ppm/°C	42 ppm/°C	280 ppm/°C		1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.37		3.35	0.001		0.002	0.06%			0.8 kN/m	94V-0	14-16 ppm/°C
R-5785(N)/R-5680(N)	200 °C		210 °C	400 °C	>120 min	>120 min	14-16 ppm/°C	42 ppm/°C	280 ppm/°C	0.40 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4		3.4	0.001		0.002	0.06%	19 GPa	18 GPa	0.8 (Cu:H-VLP)	94V-0	14-16 ppm/°C
R-5785(GE)/R-5680(GE)	200 °C		210 °C	400 °C	>120 min	>120 min	14-16 ppm/°C	42 ppm/°C	280 ppm/°C		1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.63		3.61	0.002		0.003	0.06%			0.8 kN/m	94V-0	14-16 ppm/°C
R-578Y(N)	200 °C		210 °C	400 °C	> 120 min	> 120 min	14 - 16 ppm/°C	42 ppm/°C	280 ppm/°C		1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.37	3.31 @ 14 GHz		0.001	0.0023 @ 14 GHz		0.06			0.8	94V-0
R-578Y(G)	200 °C	190 °C	210 °C	400 °C	> 120 min	>120 min	14 - 16 ppm/°C	42 ppm/°C	280 ppm/°C		1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.63	3.60 @ 13 GHz		0.002	0.0034 @ 13 GHz		0.06			0.8	94V-0