MEGTRON 6 - Halogen Free

Ultra-low Loss, Highly Heat-Resistant Circuit Board Materials

All The Performance Of MEGTRON 6 Now Available In A Halogen-Free Version

Low Dielectric Constant (Dk) Glass Cloth Type – Laminate R-5375(N)/Prepreg R-5370(N)

E glass Cloth Type - Laminate R-5375(E)/Prepreg R-5370(E)

The high glass transition temperature (Tg) and low expansion ratio of MEGTRON 6 - Halogen Free makes it ideal for High-Density Interconnect (HDI) constructions.

End-use applications include high layer count Printed Circuit Boards (PCBs) for ICT infrastructure equipment, high-speed networking including servers, routers and optical networks.

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MEGTRON 6 - Halogen Free

Part number list

Results 4

Models table for series MEGTRON 6 - Halogen Free
Part No.	Tg (TMA), (°C)	Tg (DMA),	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-Y	CTE-Y,	CTE-Z	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 12 GHz	Water Absorption (%)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-537Y(E)/R-527Y	210	250	435	> 120	>120	14 - 16	14 - 16	39	200				3.72	3.66 @ 13 GHz	0.002	0.0037 @ 13 GHz	0.22	0.6	94V-0
R-537Y(N)/R-527Y	210	250	435	> 120	> 120	14 - 16	14 - 16	39	200				3.42	3.36 @ 13 GHz	0.001	0.0029 @ 13 GHz	0.23	0.6	94V-0
R-5375(E)/R-5370(E)	210 °C	250 °C	435 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	39 ppm/°C	200 ppm/°C	0.37 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.7	3.7	0.002	0.004	0.22%	0.6 (CuH-VLP2) kN/m	94V-0 equivalent	0.75 mm
R-5375(N)/R-5370(N)	210 °C	250 °C	435 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	39 ppm/°C	200 ppm/°C	0.37 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4	3.4	0.001	0.003	0.23%	0.6 (Cu:H-VLP2) kN/m	94V-0 equivalent	0.75 mm

Models table for series MEGTRON 6 - Halogen Free
Part No.	Tg (TMA), (°C)	Tg (DMA),	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-Y	CTE-Y,	CTE-Z	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 12 GHz	Water Absorption (%)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-537Y(E)/R-527Y	210	250	435	> 120	>120	14 - 16	14 - 16	39	200				3.72	3.66 @ 13 GHz	0.002	0.0037 @ 13 GHz	0.22	0.6	94V-0
R-537Y(N)/R-527Y	210	250	435	> 120	> 120	14 - 16	14 - 16	39	200				3.42	3.36 @ 13 GHz	0.001	0.0029 @ 13 GHz	0.23	0.6	94V-0
R-5375(E)/R-5370(E)	210 °C	250 °C	435 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	39 ppm/°C	200 ppm/°C	0.37 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.7	3.7	0.002	0.004	0.22%	0.6 (CuH-VLP2) kN/m	94V-0 equivalent	0.75 mm
R-5375(N)/R-5370(N)	210 °C	250 °C	435 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	39 ppm/°C	200 ppm/°C	0.37 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4	3.4	0.001	0.003	0.23%	0.6 (Cu:H-VLP2) kN/m	94V-0 equivalent	0.75 mm