MEGTRON 6 - Halogen Free
Ultra-low Loss, Highly Heat-Resistant Circuit Board Materials
All The Performance Of MEGTRON 6 Now Available In A Halogen-Free Version.
Low Dielectric Constant (Dk) Glass Cloth Type – Laminate R-5375(N)/Prepreg R-5370(N)
E glass Cloth Type - Laminate R-5375(E)/Prepreg R-5370(E)
The high glass transition temperature (Tg) and low expansion ratio of MEGTRON 6 - Halogen Free makes it ideal for High-Density Interconnect (HDI) constructions.
End-use applications include high layer count Printed Circuit Boards (PCBs) for ICT infrastructure equipment, high-speed networking including servers, routers and optical networks.
Part Number List
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| Part No. | Datasheet | Tg (DSC), | Tg (TMA), (°C) | Tg (DMA), | Td (Thermal Decomposition) (°C) | T288 (Without Cu) (min) | T288 (With Cu) (min) | CTE-Y <Tg (ppm/℃) | CTE-Y, <Tg | CTE-Z <Tg (ppm/℃) | CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | Thermal Conductivity, (W/m・K) | Volume Resistivity (MΩ・cm) | Surface Resistivity (mΩ) | Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | Df at 1 GHz | Df at 10 GHz | Df at 12 GHz | Water Absorption (%) | Peel Strength (1 Oz. Cu) (kN/m) | Flammability | Sample Thickness (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
210 °C | 250 °C | 435 °C | >120 min | >120 min | 14-16 ppm/°C | 14-16 ppm/°C | 39 ppm/°C | 200 ppm/°C | 0.37 W/m · K | 1 x 10⁹ MΩ · cm | 1 x 10⁸ MΩ | 3.7 | 3.7 | 0.002 | 0.004 | 0.22% | 0.6 (CuH-VLP2) kN/m | 94V-0 equivalent | 0.75 mm | |||||
210 °C | 250 °C | 435 °C | >120 min | >120 min | 14-16 ppm/°C | 14-16 ppm/°C | 39 ppm/°C | 200 ppm/°C | 0.37 W/m · K | 1 x 10⁹ MΩ · cm | 1 x 10⁸ MΩ | 3.4 | 3.4 | 0.001 | 0.003 | 0.23% | 0.6 (Cu:H-VLP2) kN/m | 94V-0 equivalent | 0.75 mm |
