Specifications
Item | Performance characteristics |
---|---|
Tg (TMA), (°C) | 210 °C |
Tg (DMA), | 250 °C |
Td (Thermal Decomposition) (°C) | 435 °C |
T288 (Without Cu) (min) | >120 min |
T288 (With Cu) (min) | >120 min |
CTE-Y <Tg (ppm/℃) | 14-16 ppm/°C |
CTE-Y, <Tg | 14-16 ppm/°C |
CTE-Z <Tg (ppm/℃) | 39 ppm/°C |
CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | 200 ppm/°C |
Thermal Conductivity, (W/m・K) | 0.37 W/m · K |
Volume Resistivity (MΩ・cm) | 1 x 10⁹ MΩ · cm |
Surface Resistivity (mΩ) | 1 x 10⁸ MΩ |
Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | 3.7 |
Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | |
Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | 3.7 |
Df at 1 GHz | 0.002 |
Df at 10 GHz | |
Df at 12 GHz | 0.004 |
Water Absorption (%) | 0.22% |
Peel Strength (1 Oz. Cu) (kN/m) | 0.6 (CuH-VLP2) kN/m |
Flammability | 94V-0 equivalent |
Sample Thickness (mm) | 0.75 mm |
Stock check
R-5375(E)/R-5370(E)
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