Item | Performance characteristics |
---|---|
Tg (DSC), | 173 °C |
Tg (TMA), (°C) | 170 °C |
Tg (DMA), | 190 °C |
Td (Thermal Decomposition) (°C) | 385 °C |
T288 (Without Cu) (min) | >120 min |
T288 (With Cu) (min) | 25 min |
CTE-Y <Tg (ppm/℃) | 14-16 ppm/°C |
CTE-Y, <Tg | 14-16 ppm/°C |
CTE-Z <Tg (ppm/℃) | 35 ppm/°C |
CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | 210 ppm/°C |
Thermal Conductivity, (W/m・K) | 0.50 W/m · K |
Surface Resistivity (mΩ) | |
Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | 4.2 |
Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | 4.1 |
Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | |
Df at 1 GHz | 0.01 |
Df at 10 GHz | 0.013 |
Df at 12 GHz | |
Water Absorption (%) | |
Poisson's Ratio | 0.2 |
Flexural Warp (MD) (GPa) | 25 GPa |
Flexural Fill (TD) (GPa) | 23 GPa |
Peel Strength (1 Oz. Cu) (kN/m) | 1.3 kN/m |
Flammability | 94V-0 |
Sample Thickness (mm) | 0.8mm |
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