Ultra-low Loss, Highly Heat-Resistant Circuit Board Materials

All The Performance Of MEGTRON 6 Now Available In A Halogen-Free Version

Low Dielectric Constant (Dk) Glass Cloth Type – Laminate R-5375(N)/Prepreg R-5370(N)

E glass Cloth Type - Laminate R-5375(E)/Prepreg R-5370(E)

The high glass transition temperature (Tg) and low expansion ratio of MEGTRON 6 - Halogen Free makes it ideal for High-Density Interconnect (HDI) constructions.

End-use applications include high layer count Printed Circuit Boards (PCBs) for ICT infrastructure equipment, high-speed networking including servers, routers and optical networks.

Series image for MEGTRON 6 - Halogen Free

MEGTRON 6 - Halogen Free

Part number list

Results 4
Models table for series MEGTRON 6 - Halogen Free
Part No.Datasheet Tg (DSC), Tg (TMA), (°C)Tg (DMA), Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-Y CTE-Y, CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
210
250
435
> 120
>120
14 - 16
14 - 16
39
200
3.72
3.66 @ 13 GHz
0.002
0.0037 @ 13 GHz
0.22
0.6
94V-0
210
250
435
> 120
> 120
14 - 16
14 - 16
39
200
3.42
3.36 @ 13 GHz
0.001
0.0029 @ 13 GHz
0.23
0.6
94V-0
210 °C
250 °C
435 °C
>120 min
>120 min
14-16 ppm/°C
14-16 ppm/°C
39 ppm/°C
200 ppm/°C
0.37 W/m · K
1 x 10⁹ MΩ · cm
1 x 10⁸ MΩ
3.4
3.4
0.001
0.003
0.23%
0.6 (Cu:H-VLP2) kN/m
94V-0 equivalent
0.75 mm
210 °C
250 °C
435 °C
>120 min
>120 min
14-16 ppm/°C
14-16 ppm/°C
39 ppm/°C
200 ppm/°C
0.37 W/m · K
1 x 10⁹ MΩ · cm
1 x 10⁸ MΩ
3.7
3.7
0.002
0.004
0.22%
0.6 (CuH-VLP2) kN/m
94V-0 equivalent
0.75 mm