MEGTRON 2 - Halogen Free

Halogen-Free, Low Transmission Loss, Highly Heat-Resistant Multi-Layer Circuit Board Material

MEGTRON 2 Laminate R-1577/Prepreg R-1570

MEGTRON 2 is a high density, interconnect (HDI) compatible, halogen free, high glass transition temperature (Tg) material suitable for high-speed data transmission applications.

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Models table for series MEGTRON 2 - Halogen Free
Part No.	Datasheet	Tg (DSC),	Tg (TMA), (°C)	Tg (DMA),	Thermal Conductivity, (W/m・K)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-Y <Tg (ppm/℃)	CTE-Y, <Tg	CTE-Z <Tg (ppm/℃)	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Td (Thermal Decomposition) (°C)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Water Absorption (%)	Poisson's Ratio	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-1577/R-1570		170 °C	165 °C	190 °C	380 °C	>120 min	25 min	14-16 ppm/°C	14-16 ppm/°C	34 ppm/°C	200 ppm/°C	0.50 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	4.1	4		0.01	0.013	0.14%	0.2	25 GPa	23 GPa	1.3 kN/m	94V-0	0.8 mm

Models table for series MEGTRON 2 - Halogen Free
Part No.	Datasheet	Tg (DSC),	Tg (TMA), (°C)	Tg (DMA),	Thermal Conductivity, (W/m・K)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-Y <Tg (ppm/℃)	CTE-Y, <Tg	CTE-Z <Tg (ppm/℃)	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Td (Thermal Decomposition) (°C)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 10 GHz	Water Absorption (%)	Poisson's Ratio	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-1577/R-1570		170 °C	165 °C	190 °C	380 °C	>120 min	25 min	14-16 ppm/°C	14-16 ppm/°C	34 ppm/°C	200 ppm/°C	0.50 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	4.1	4		0.01	0.013	0.14%	0.2	25 GPa	23 GPa	1.3 kN/m	94V-0	0.8 mm

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