With high ductility, this liquid Sidefill features improved crack resistance to reinforce solder joints. This product has high drop impact resistance and is good for Large Scale Integration (LSI) packages and Solid-State Drives (SSD) in laptops, digital cameras, mobile phones, smartphones and tablets.
Part No. | Datasheet | Viscosity (Pa Sec) | Thixotrophy | Glass Trans. Temp (°C) | Gelation Time (Sec) | CTE (°C) | Volume Resistivity (MΩ・cm) |
---|---|---|---|---|---|---|---|
80 | 4.50 | 40 | 7.0 x 10-5 | 1x1015 |
Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement