Menu
Products
Resources
Direct Technology
Solutions
What's New
Blog
Subscribe
Contact Us
Sales & Support
B2B
Search
Electronic Materials
Electronic Assembly Materials
Sidefill & Corner Bond
Impact-Resistant Sidefill
CV5314
CV5314
Resources
Check Stock
CV5314
Resources
Specification
Specifications table for model CV5314
Item
Performance characteristics
Viscosity (Pa Sec)
80
Thixotrophy
4.50
Glass Trans. Temp (°C)
40
Gelation Time (Sec)
CTE (°C)
7.0 x 10-5
Volume Resistivity (MΩ・cm)
1x1015
Stock Check
Change region
North America
Europe
Asia
Check Stock
What's New
Stay up to date
View All
New Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Electronic Materials Icon
New Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Navigate Previous
Navigate Next
Latest Videos
Playlist
Electronic Materials
Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Electronic Materials Icon
Electronic Materials Icon
Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Navigate Previous
Navigate Next