Panasonic offers a wide range of specialty encapsulation materials for laminate-based semiconductor packaging designs. These products provide an unmatched combination of performance, processability, and reliability.

Molded Underfill (MUF) For flip-chip Chip Scale Packaging (fcCSP) from Panasonic exhibit superior warpage control even on challenging thin die and coreless package designs. These industry-proven products for transfer molding have an excellent filling performance to enable large die and narrow interconnect pitch construction. Standard, high-volume products include CV8710 Series and CV8715 Series. Additional options are available upon request.