IC Packaging Materials Products

• LEXCM GX Substrates

  Panasonic's IC Substrate materials meet the challenge of emerging heterogeneous advanced package architectures.

• IC Encapsulants - Laminate Packages

  IC Encapsulants - Laminate Packages for better performance, processability and reliability.

• IC Encapsulants - Wafer Level Packages

  Panasonic has developed a wide range of IC encapsulants for fan out wafer and panel level packaging.