High Performance, High Quality, High Reliability
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Panasonic's IC Substrate materials meet the challenge of emerging heterogeneous advanced package architectures.
IC Encapsulants - Laminate Packages for better performance, processability and reliability.
Panasonic has developed a wide range of IC encapsulants for fan out wafer and panel level packaging.
Best-in-class processing and readily available in North America: MEGTRON, Hiper, Felios
Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
Where Technology Meets Humanity