Featuring low transmission loss, designed for high-speed communication equipment applications such as 5G, aerospace, automotive, and more!
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Panasonic's IC Substrate materials meet the challenge of emerging heterogeneous advanced package architectures.
IC Encapsulants - Laminate Packages for better performance, processability and reliability.
Panasonic has developed a wide range of IC encapsulants for fan out wafer and panel level packaging.
BEYOLEX™ Thermosetting Stretchable Film, designed for conformable and pliable printed electronics applications and more!
MEGTRON and XPEDION Series: Connecting to the Future with PCB Materials
Panasonic LEXCM: Introduction to EMC Technology
Panasonic CES Tech Talk: Beyond Flexible Panasonic Soft Circuit Materials
BEYOLEX™ Stretchable Circuit Materials
Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
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