How Advances in Rigid and Flexible Circuit Materials Impact PWB Design in 2025
- Electronic Materials
Panasonic's Darren Hitchcock will present a session on how advances in rigid and flexible circuit materials impact PWB design at the NEDME conference on October 22.
The NW Electronics Design & Manufacturing Expo (NEDME) is the premier trade show and networking event for members of the high-tech industry in the Pacific northwest.
Darren's session focuses on new and advanced technologies for printed circuit board and flexible circuit raw materials, touching on the move toward smooth copper and low-loss dielectric materials for improved signal integrity.
Darren, Panasonic Group Manager with Panasonic Electronic Materials, has over 30 years experience in the PCB industry having worked at Tektronix and Intel. He currently manages the team responsible for data center and networking markets for Panasonic and is chair of the IPC 3-11a subcommittee responsible for the IPC-41-1 laminate and prepreg specification.
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