Panasonic's leading-edge IC Substrate materials enable next-generation Semiconductor packaging designs and can meet the challenge of emerging heterogeneous advanced package architectures.

These high-performance materials are available for a range of package formats including flip chip ball grid array (fcBGA), chip-scale packages (CSP) and flip chip chip-scale packages (fcCSP).

These Substrates are perfect for the new devices with low package profiles, high I/O counts, better Thermal Management requirements and improved signal integrity required by markets like Wearables, the Internet of Things (IoT) and 5G Networks. Panasonic advanced Substrates offer low-stress technology and the best warpage control in the IC Packaging Industry.