FC-BGA

For Flip Chip Ball Grid Array (fcBGA) applications, Panasonic offers materials with excellent CTE, low stress performance and high heat resistance properties

This enables reliable manufacturing and optimal field performance for both first and second level packaging requirements.

Part Number List

Results 5
Models table for series FC-BGA
Part No.DatasheetTg (DMA) (°C)Dk at 1 GHzDf at 1 GHzCTE-X, CTE α1 Y-axis: Test Method Internal; Condition A (ppm/℃)Flexural Modulus: Test method JIS C 6481; Condition 25℃ (GPa)Flexural Modulus: Test method JIS C 6481; Condition 250℃ (GPa)Peel Strength 1/3 oz (12μm): Test method IPC-TM-650 2.4.8; Condition A (kN/m)Thickness Line-up (mm)
250-260
4.4
0.015
4-6
4-6
32-34
250
9
9
4.8
0.015
35
21
0.9
0.20~0.8
260
4.4
0.016
3-5
3-5
30
14
0.6
205
12
12
4.8
0.015
27
10
0.9
0.10~0.8
250-260
4.6
0.015
7-8
7-8
28-30

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