FC-BGA

This enables reliable manufacturing and optimal field performance for both first and second level packaging requirements.

Models table for series FC-BGA
Part No.	Tg (DMA) (°C)	Dk at 1 GHz	Df at 1 GHz	CTE-X, <Tg (ppm/℃)	CTE α1 Y-axis: Test Method Internal; Condition A (ppm/℃)	Flexural Modulus: Test method JIS C 6481; Condition 25℃ (GPa)	Flexural Modulus: Test method JIS C 6481; Condition 250℃ (GPa)	Peel Strength 1/3 oz (12μm): Test method IPC-TM-650 2.4.8; Condition A (kN/m)	Thickness Line-up (mm)
R-1515A/R-1410A	205	12	12	4.8	0.015	27	10	0.9	0.10~0.8
R-1515V	260	4.4	0.016	3-5	3-5	30	14	0.6
R-G535S	250-260	4.4	0.015	4-6	4-6	32-34
R-G535E	250-260	4.6	0.015	7-8	7-8	28-30
R-1515W/R-1410W	250	9	9	4.8	0.015	35	21	0.9	0.20~0.8

Models table for series FC-BGA
Part No.	Tg (DMA) (°C)	Dk at 1 GHz	Df at 1 GHz	CTE-X, <Tg (ppm/℃)	CTE α1 Y-axis: Test Method Internal; Condition A (ppm/℃)	Flexural Modulus: Test method JIS C 6481; Condition 25℃ (GPa)	Flexural Modulus: Test method JIS C 6481; Condition 250℃ (GPa)	Peel Strength 1/3 oz (12μm): Test method IPC-TM-650 2.4.8; Condition A (kN/m)	Thickness Line-up (mm)
R-1515A/R-1410A	205	12	12	4.8	0.015	27	10	0.9	0.10~0.8
R-1515V	260	4.4	0.016	3-5	3-5	30	14	0.6
R-G535S	250-260	4.4	0.015	4-6	4-6	32-34
R-G535E	250-260	4.6	0.015	7-8	7-8	28-30
R-1515W/R-1410W	250	9	9	4.8	0.015	35	21	0.9	0.20~0.8